Deposition of thin and thick layers
Photolithography
UV & electronic lithography Photolithography mask manufacturing
Deposition of thin and thick layers
Deposition of thin and thick layers
contact : florent.bassignot@femto-engineering.fr
UV & electronic lithography Photolithography mask manufacturing
Dry etching (ion plasma): RIE, DRIE FIB (Focus Ion Beam) Materials: Silicon (max 6 inches), Glass, Si3N4, LiNbO3,… (max 4
Precision cutting Lapping & polishing Wire bonding Wafer bonding Micro-assembly (flip-chip)
Microscope (MEB, optic, FIB), mechanical profilometer Specific measures : material constraints, optical index, contact angle
Femto Engineering | From science to society
15B avenue des Montboucons, 25030 Besançon Cedex – France
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