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Wafer Hybrid

FEMTO Engineering has developed a technology to obtain custom thin monocrystalline layers transferred onto wafers with diameters up to 4 inches.

BENEFITS

Material properties are preserved
Possibility of modulating the stacks according to:
– materials: crystals, metals or polymers,
– thickness: from a few microns to several hundred microns,
– interfaces: metallic or insulating.

Our custom hybrid substrates:

Thin monocrystalline films on electrode or insulator

Support materials and custom thin layers among piezoelectric materials (quartz, PZT, LiNbO3),
optics (Glass, KBT, BSO …), semiconductors (Silicon) and other materials on request.

Wafer size: from sample to 4 inch diameter plates
Useful surface > 98%
Bonding strength > 25MPa
Layer thickness: from 1µm to a few hundred microns
Number of layers in the stack: 1 to 10