- Polymer mold
- Metal mold
- Silicon mold
SPR chips
– Manufacturing of chips with plasmonic properties (SPR)
– Specific coatings (SiO2, TiO2, etc)
– Biofonctionnalization
We have developed manufacturing processes for resin, silicon and metal molds.
The molds are developed on plates up to 6 inches in diameter.
The resolution obtained is micrometric.
The thickness of the patterns ranges from a micron to several tens of microns.
The applications are diverse, from watchmaking with the manufacture of micro-parts (LIGA), to bio-medical with the molding of PDMS for example.
Resin |
Metal |
Silicon |
Wafer (silicon, glass) | Wafer (silicon, glass) | Silicium wafer |
Specifications
|
Specifications
|
Specifications
|
– Manufacturing of chips with plasmonic properties (SPR)
– Specific coatings (SiO2, TiO2, etc)
– Biofonctionnalization
– Multi-material metallic bonding
– Multi-material thinning
– Multi-material thin layers
Femto Engineering | From science to society
15B avenue des Montboucons, 25030 Besançon Cedex – France
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